Technical Program Committee

Members

• Adrien F Vincent, Bordeaux INP
• Amit Trivedi, University of Illinois at Chicago
• Asif Ali Khan, TU Dresden
• Ben Feinberg, Sandia National Laboratories
• Christina Giannoula, Max Planck Institute for Software Systems
• Daichi Fujiki, Institute of Science Tokyo
• Elaheh Sadredini, University of California, Riverside
• Fengbin Tu, The Hong Kong University of Science and Technology
• Franck Melul, Aix-Marseille University
• Georgios Sirakoulis, Democritus University of Thrace
• Geraldo F. Oliveira, Huawei Switzerland
• Giovanni Finocchio, University of Messina
• Guangyu Sun, Peking University
• Haitong Li, Purdue University
• Haiyu Mao, ETH Zurich
• Hua Fan, University of Electronic Science and Technology of China
• Ioannis Vourkas, Democritus University of Thrace
• Ingchao Lin, National Yang Ming Chiao Tung University
• Jean-Philippe Noel, CEA-List
• Jinshan Yue, Institutes of Microelectronics of the Chinese Academy of Sciences
• Jisung Park, POSTECH
• Joseph S. Friedman, The University of Texas at Dallas
• Leonid Yavits, Bar Ilan University
• Lizy K. John, University of Texas at Austin
• Laura Bégon-Lours, ETH Zurich
• Madhava Vemuri, University of Washington, Bothell
• Minxuan Zhou, Illinois Institute of Technology
• Mohammad Alian, Cornell University
• Nikhil Garg, University of Groningen
• Rachata Ausavarungnirun, MangoBoost
• Sunbin Deng, Huazhong University of Science and Technology
• Shaloo Rakheja, University of Illinois at Urbana-Champaign
• Shuwen Deng, Tsinghua University
• Swaroop Ghosh, Pennsylvania State University
• Stephan Menzel, Forschungszentrum Jülich
• Thierry Tambe, Stanford University
• Thomas Kämpfe, TU Braunschweig
• Xiaoming Chen, Institute of Computing Technology, Chinese Academy of Sciences
• Xiyuan Tang, Peking University
• Xingsheng Wang, Huazhong University of Science and Technology
• Xuanyao Fong, National University of Singapore
• Yanan Sun, Shanghai Jiaotong University
• Yann Beilliard, Université Grenoble Alpes

*This is a preliminary list, more names will be added...